Please use this identifier to cite or link to this item: http://dspace2020.uniten.edu.my:8080/handle/123456789/8796
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dc.contributor.authorYik, L.C.
dc.contributor.authorKar, Y.B.
dc.contributor.authorShafika, N.
dc.date.accessioned2018-02-21T04:29:30Z-
dc.date.available2018-02-21T04:29:30Z-
dc.date.issued2012
dc.identifier.urihttp://dspace.uniten.edu.my/jspui/handle/123456789/8796-
dc.description.abstractSilver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler. © 2012 IEEE.
dc.titleStudy on reliability test of die attach material
item.fulltextNo Fulltext-
item.grantfulltextnone-
Appears in Collections:COE Scholarly Publication
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