Please use this identifier to cite or link to this item: http://dspace2020.uniten.edu.my:8080/handle/123456789/5776
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dc.contributor.authorGoh, K.H.en_US
dc.contributor.authorLee, H.J.en_US
dc.contributor.authorLau, S.K.en_US
dc.contributor.authorTeh, P.C.en_US
dc.contributor.authorRamesh, S.en_US
dc.contributor.authorTan, C.Y.en_US
dc.contributor.authorWong, Y.H.en_US
dc.date.accessioned2017-12-08T07:24:52Z-
dc.date.available2017-12-08T07:24:52Z-
dc.date.issued2017-
dc.description.abstractThis research work studied the effects of various anodization times (5, 10, 15, 20 and 25 min) and various annealing temperatures (500, 600, 700, 800 and 900 °C) on ZrO2 thin film on a Si substrate. The ZrO2 thin film was prepared via sputtering and anodization processes on a Si substrate. The existence of Si, SiO2, m-ZrO2, t-ZrO2 and ZrSiO4 was confirmed by x-ray diffraction, Fourier transform infrared microscopy and Raman spectroscopy. In addition, NaOH was observed as a residue on the surface of the thin film. The grain size and microstrain of both m-ZrO2, and t-ZrO2 were calculated using the Williamson-Hall and/or Scherrer equation. The morphology of samples was examined by scanning electron microscopy. In contrast to unannealed samples, the annealed samples have a smaller grain size, less NaOH, and SiO2 with a smoother surface. However, the SiO2 existed when being annealed at higher temperatures (≥800 °C). © 2017 IOP Publishing Ltd.en_US
dc.language.isoen_USen_US
dc.relation.ispartofVolume 4, Issue 8, August 2017, Article number 086414en_US
dc.titleInvestigation of the effect of anodization time and annealing temperature on the physical properties of ZrO2 thin film on a Si substrateen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/2053-1591/aa824e-
item.cerifentitytypePublications-
item.languageiso639-1en_US-
item.fulltextNo Fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.grantfulltextnone-
item.openairetypeArticle-
Appears in Collections:COE Scholarly Publication
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