Please use this identifier to cite or link to this item: http://dspace2020.uniten.edu.my:8080/handle/123456789/20657
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dc.contributor.authorBhargava C.en_US
dc.contributor.authorSharma P.K.en_US
dc.contributor.authorSenthilkumar M.en_US
dc.contributor.authorPadmanaban S.en_US
dc.contributor.authorRamachandaramurthy V.K.en_US
dc.contributor.authorLeonowicz Z.en_US
dc.contributor.authorBlaabjerg F.en_US
dc.contributor.authorMitolo M.en_US
dc.date.accessioned2021-07-13T04:36:49Z-
dc.date.available2021-07-13T04:36:49Z-
dc.date.issued2020-
dc.identifier.urihttp://dspace2020.uniten.edu.my:8080/handle/123456789/20657-
dc.description.abstractTo meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. © 2013 IEEE.en_US
dc.language.isoenen_US
dc.titleReview of Health Prognostics and Condition Monitoring of Electronic Componentsen_US
dc.typearticleen_US
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.languageiso639-1en-
item.fulltextWith Fulltext-
item.grantfulltextreserved-
item.openairetypearticle-
item.cerifentitytypePublications-
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