Boonkar, Y.
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Full Name
Boonkar, Y.
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Publications
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| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2014 | Manufacturability readiness of insulated Cu wire bonding process in PBGA package | Hungyang, L. ; Boonkar, Y. ; Yong, T.C. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. |