Hui, T.C.
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Full Name
Hui, T.C.
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Publications
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Results 1-3 of 3 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2012 | Solder ball robustness study on polymer core solder balls for BGA packages | Kar, Y.B. ; Hui, T.C. ; Agileswari ; Lo, C. |
| 2 | 2013 | Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls | Kar, Y.B. ; Agileswari ; Hui, T.C. ; Talik, N.A. |
| 3 | 2013 | Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests | Kar, Y.B. ; Hui, T.C. ; Agileswari, R. ; Lo, C. |