Kamarudin, H.

Full Name
Kamarudin, H.

Publications
(Others)
Results 1-1 of 1 (Search time: 0.0 seconds).
Issue Date | Title | Author(s) | |
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1 | 2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |