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Full Name
Swee, G.L.H.
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Publications
(Others)



Results 1-2 of 2 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
12006Solder bump strength and failure mode of low-k flip chip deviceEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. 
22006Impact of low-k devices on failure mode of flip chip tensile pull testEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M.