Eu, P.-L.

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Eu, P.-L.

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Date issued

1 2010 - 2019
5 2000 - 2009

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Results 1-6 of 6 (Search time: 0.0 seconds).

	Issue Date	Title	Author(s)
1	2011	Process optimization approach in fine pitch Cu wire bonding	Wong, B.K. ; Yong, C.C. ; Eu, P.L. ; Yap, B.K.
2	2006	Lead-free flux effect in lead-free solder joint improvement	Eu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K.
3	2007	Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish	Eu, P.-L. ; Ding, M. ; Ahmad, I.
4	2006	Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength	Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y.
5	2006	Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance	Eu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K.
6	2007	A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish	Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I.