Seng, F.C.

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Seng, F.C.

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Date issued

2 2010 - 2019
2 2000 - 2009

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	Issue Date	Title	Author(s)
1	2013	Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology	Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V.
2	2012	Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability	Kar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C.
3	2008	Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package	Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R.
4	2009	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages	Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I.