Ding, M.

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Ding, M.
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Publications

Results 1-11 of 11 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
12007The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
22007Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finishLeng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. 
32006Lead-free flux effect in lead-free solder joint improvementEu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K. 
42007Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au FinishEu, P.-L. ; Ding, M. ; Ahmad, I. 
52009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
62006Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performanceEu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. 
72006A study on lead free SnAgCu solder systemHoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. 
82008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
92007A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
102007A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finishLeng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. 
112007A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finishEu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I.