Cheah, A.Y.
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          			Publications
        		
        		
        			
	
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Results 1-3 of 3 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 1 | 2008 | The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA | Amin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. | 
| 2 | 2008 | Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) | Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. | 
| 3 | 2010 | Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages | Amin, N. ; Cheah, A.Y. ; Ahmad, I. |