Omar, G.

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Omar, G.
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Results 1-12 of 12 (Search time: 0.015 seconds).

Issue DateTitleAuthor(s)
12006The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) depositionArshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
22004The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
32006The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. 
42007The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) depositionMd Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. 
52004Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)Kornain, Z. ; Ahmad, I. ; Omar, G. 
62004Some aspects of surface morphology and elemental analysis study on non-wetting problem at die topSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. 
72011Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal agingShualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. 
82005Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bumpSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
92008Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal agingShualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. 
102006Effect of wafer thinning methods towards fracture strength and topography of silicon dieJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
112006Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chippingJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
122004Alternative double pass dicing method for thin wafer laminated with die attach filmJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G.