Jalar, A.
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Full Name
Jalar, A.
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Publications
(Others)
Results 21-24 of 24 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 21 | 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 22 | 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
| 23 | 2007 | A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
| 4 | 2007 | A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish | Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. |