Ahmad, I.B.

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Ahmad, I.B.
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Publications

Results 81-100 of 105 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
812012Design and optimization of 22nm NMOS transistorAfifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. 
822013Design and optimization of 22 nm gate length high-k/metal gate NMOS transistorAfifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. ; Elgomati, H.A. ; Salehuddin, F. 
832004Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devicesHamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. 
842007Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold processMd Arshad, M.K. ; Jalar, A. ; Ahmad, I. 
852008Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array packageLim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. 
862010Characterization of fabrication process noises for 32nm NMOS devicesElgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. ; Ziad, T. 
872002Characterisation of polysilicon gate microstructures for 0.5 μm CMOS devices using transmission electron microscopy and atomic force microscopy imagesAhmad, I. ; Omar, A. ; Hussain, A. ; Mikdad, A. 
882009BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloyLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. 
892014Application of Taguchi method in designing a 22nm high-k/metal gate NMOS transistorAfifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Shaari, S. 
902008An experimental study of defect determination using pulsed thermal non-destructive testingUmar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W. 
912008An efficient first order sigma delta modulator designAmin, N. ; Guan, G.C. ; Ahmad, I. 
922004An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devicesOmar, A. ; Kamariah, S. ; Ahmad, I. 
932004An alternative approach to measures the application of dispatching rule in the wafer foundryChik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. 
942004Alternative double pass dicing method for thin wafer laminated with die attach filmJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
952006Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performanceEu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. 
962006A study on lead free SnAgCu solder systemHoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. 
972006A study on inter-metallic compound formation and structure of lead free SnAgCu solder systemAhmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. 
982008A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder jointLeng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. 
992007A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
1002008A study of lead-free BGA backward compatibility through solderability testing at component levelLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I.