Ahmad, I.B.

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Ahmad, I.B.
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Publications

Results 41-60 of 105 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
412011Optimization of HALO structure effects in 45nm p-type MOSFETs device using taguchi methodSalehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. ; Elgomati, H.A. ; Majlis, B.Y. ; Apte, P.R. 
422010Numerical study of fluid flow and heat transfer in microchannel heat sinks using anisotropic porous media approximationLim, F.Y. ; Abdullah, S. ; Ahmad, I. 
432011Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal agingShualdi, W. ; Bais, B. ; Ahmad, I. ; Omar, G. ; Isnin, A. 
442012Morphology and optical properties of nickel oxide nanostructure from aqueous solutionHamid, M.A.A. ; Bakar, M.A. ; Jalar, A. ; Shamsudin, R. ; Ahmad, I. 
452006Modelling of sacrificial spin-on glass (SOG) etching in non-straight microchannels using hydrofluoric acidHamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. 
462012Modelling of process parameters for 32nm PMOS transistor using Taguchi methodElgomati, H.A. ; Majlis, B.Y. ; Hamid, A.M.A. ; Susthitha, P.M. ; Ahmad, I. 
472009Modelling and simulation single layer Anti-Reflective Coating of ZnO and ZnS for silicon solar cells using silvaco softwareAbdullah, H. ; Lennie, A. ; Ahmad, I. 
482015Modeling of 14 nm gate length n-Type MOSFETFaizah, Z.A.N. ; Ahmad, I. ; Ker, P.J. ; Roslan, P.S.A. ; Maheran, A.H.A. 
492012Modeling and optimizing of threshold voltage of 32nm NMOS transistor using L18 orthogonal array Taguchi methodElgomati, H.A. ; Majlis, B.Y. ; Ahmad, I. 
502005Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bumpSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
512011Message from chair of ED chapter, IEEE Malaysia section (Co-Chair RSM 2011)Ahmad, I. 
522010Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal conditionHarif, M.N. ; Ahmad, I. 
532002MATLAB based image analysis software for characterization of microstructure materialsHussain, A. ; Muad, A.M. ; Ahmad, I. ; Azhari, C.H. 
542008Lead-free solder ball attach improvement on FCPBGA with SOP pad finishingLing, W.T. ; Leng, E.P. ; Amin, N. ; Ahmad, I. 
552006Lead-free flux effect in lead-free solder joint improvementEu, P.L. ; Ding, M. ; Ahmad, I. ; Hoh, H.J. ; Hazlinda, K. 
562007Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au FinishEu, P.-L. ; Ding, M. ; Ahmad, I. 
572008Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal agingShualdi, W. ; Ahmad, I. ; Omar, G. ; Isnin, A. 
582008Improved series resistance model for CMOS ESD diodesKamal, N.B. ; Kordesch, A.V. ; Ahmad, I.B. 
592006Impact of low-k devices on failure mode of flip chip tensile pull testEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. 
602012High performance of a SOI-based lateral PIN photodiode using SiGe/Si multilayer quantum wellMenon, P.S. ; Tasirin, S.K. ; Ahmad, I. ; Abdullah, S.F.