Ahmad, I.B.

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Ahmad, I.B.
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Publications

Results 21-40 of 105 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
212012Statistical modeling of solar cell using Taguchi method and TCAD toolBahrudin, M.S. ; Abdullah, S.F. ; Ahmad, I. 
222009Statistical design of ultra-thin SiO2 for nanodevicesHashim, U. ; Abdul Fatah, M.F.A. ; Ahmad, I. ; Majlis, B.Y. 
232008Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometerHamzah, A.A. ; Yunas, J. ; Majlis, B.Y. ; Ahmad, I. 
242004Some aspects of surface morphology and elemental analysis study on non-wetting problem at die topSalleh, M.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Abdullah, S.H. ; Arshad, M.K. 
252006Solder joint strength of lead free solders under multiple reflow and high temperature storage conditionAhmad, I. ; Jalar, A. ; Majlis, B.Y. ; Leng, E.P. ; San, Y.S. 
262006Solder bump strength and failure mode of low-k flip chip deviceEndut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. 
272009Simulation of fabrication process VDMOSFET transistor using Silvaco softwareAbdullah, H. ; Jurait, J. ; Lennie, A. ; Nopiah, Z.M. ; Ahmad, I. 
282008Selection of high strength encapsulant for MEMS devices undergoing high-pressure packagingHamzah, A.A. ; Husaini, Y. ; Majlis, B.Y. ; Ahmad, I. 
292012Scaling down of the 32 nm to 22 nm gate length NMOS transistorAfifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Elgomati, H.A. ; Majlis, B.Y. ; Salehuddin, F. 
302012Robust optimization of a silicon lateral pin photodiodeKalthom Tasirin, S. ; Susthitha Menon, P. ; Ahmad, I. ; Fazlili Abdullah, S. 
312000Review on policies, research & development in microelectronic industry in MalaysiaAhmad, I.B. ; Sulaiman, N.B. 
322014Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing systemAdhila Muhammad, N. ; Bais, B. ; Ahmad, I. 
332008Reduction of warpage occurrence on stack-die QFN using FEA and statistical methodAbdullah, I. ; Ahmad, I. ; Talib, M.Z.M. ; Kamarudin, M.N.B.C. 
342006Pulse power failure model of power MOSFET due to electrical overstress using tasca methodIsmail, N.S. ; Ahmad, I. ; Husain, H. ; Chuah, S. 
352016Process Parameters Optimization of 14nm MOSFET Using 2-D Analytical ModellingNoor Faizah, Z.A. ; Ahmad, I. ; Ker, P.J. ; Siti Munirah, Y. ; Mohd Firdaus, R. ; Md Fazle, E. ; Menon, P.S. 
362006Performances test statistics for single outlier detection in bilinear (1,1,1,1) modelsZaharim, A. ; Mohamed, I. ; Ahmad, I. ; Abdullah, S. ; Omar, M.Z. 
372007Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finishLeng, E.P. ; Ding, M. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. ; Jalar, A. 
382002Pass transistor logic ALU designWagiran, R. ; Chong, A.B. ; Ahmad, I. 
392009Optimization of PV-Wind-Hydro-Diesel hybrid system by minimizing excess capacityAb. Razak, J. ; Sopian, K. ; Ali, Y. ; Alghoul, M.A. ; Zaharim, A. ; Ahmad, I. 
402007Optimization of nickel thickness on substrate for TBGA using SAC387 solder materialAhmad, I. ; Majlis, B.Y. ; Jalar, A. ; Leng, E.P.