Ahmad, I.B.
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Ahmad, I.B.
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Results 101-105 of 105 (Search time: 0.0 seconds).
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 101 | 2010 | A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility | Chik, M.A. ; Yung, V.C. ; Balakrishna, P. ; Hashim, U. ; Ahmad, I. ; Mohamad, B. |
| 102 | 2004 | A simulation approach for dispatching techniques comparison in 200mm wafer foundry | Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. |
| 103 | 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
| 104 | 2007 | A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish | Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. |
| 105 | 2007 | A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish | Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. |