Ahmad, I.B.

View Statistics Email Alert RSS Feed

Profile

Loading... 2 0 20 0 false
Full Name
Ahmad, I.B.
Loading... 3 0 20 0 false

Publications

Results 1-20 of 105 (Search time: 0.016 seconds).

Issue DateTitleAuthor(s)
12007Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methodsAbdullah, I. ; Chiang, N.C. ; Mokhtar, U. ; Said, A. ; Talib, M.Z.M. ; Ahmad, I. 
22008Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphologyNor, N.H.M. ; Taib, S. ; Ahmad, I. ; Abdullah, H. 
32011Throughput improvement in semiconductor fabrication for 0.13μm technologyBalakrishna, P. ; Chik, M.A. ; Ahmad, I. ; Mohamad, B. 
42013Threshold voltage optimization in a 22nm High-k/Salicide PMOS deviceAfifah Maheran, A.H. ; Menon, P.S. ; Ahmad, I. ; Yusoff, Z. 
52006The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) depositionArshad, M.K.M. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
62004The effects of zincation process on aluminum bond pad surfaces for Electroless Nickel Immersion Gold (ENIG) depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
72006The effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold depositionMd Arshad, M.K. ; Ahmad, I. ; Jalar, A. ; Omar, G. ; Hashim, U. 
82006The effects of high temperature storage on lead free solder joint material strength using pull test methodHarif, M.N. ; Ahmad, I. ; Zaharim, A. 
92008The effect of surface texturing on GaAs solar cell using TCAD toolsJalil, S.M. ; Abdullah, L. ; Ahmad, I. ; Abdullah, H. 
102006The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packagingAbdullah, S.H. ; Ahmad, I. ; Jalar, A. 
112007The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finishLeng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. 
122008The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGAAmin, N. ; Cheah, A.Y. ; Kornain, Z. ; Ahmad, I. 
132006The characterization of KrF photoresists and the effect of different chromophore bulkiness on line edge roughness (LER) for submicron technologyYusri, A. ; Bakri, M. ; Manaf, M.J. ; Wahab, K.I.A. ; Ahmad, I.B. 
142007The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) depositionMd Arshad, M.K. ; Jalar, A. ; Ahmad, I. ; Omar, G. 
152004Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)Kornain, Z. ; Ahmad, I. ; Omar, G. 
162012Technique to improve visibility for cycle time improvement in semiconductor manufacturingRahim, S.R.A. ; Ahmad, I. ; Chik, M.A. 
172006TCAD Simulation of STI stress effect on active length for 130nm technologyAhmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Yew, P.T.B. 
182006TCAD simulation of local mechanical stress reduction by use of a compressive silicon nitride/silicon oxynitride etch stop bi-layer for CMOS performance enhancementAhmad, W.R.W. ; Kordesch, A.V. ; Ahmad, I. ; Chew, S.A. ; Yew, P.T.B. 
192006Study of lifetime prediction of N-MOS transistor due to hot carrier effectAhmad, I. ; Kornain, Z. ; Idros, M.F.M. 
202014Statistical process modelling for 32nm high-K/metal gate PMOS deviceMaheran, A.H.A. ; Noor Faizah, Z.A. ; Menon, P.S. ; Ahmad, I. ; Apte, P.R. ; Kalaivani, T. ; Salehuddin, F.