Ahmad, I.B.

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Ahmad, I.B.
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Publications

Results 61-80 of 105 (Search time: 0.0 seconds).

Issue DateTitleAuthor(s)
612007HF etching of sacrificial spin-on glass in straight and junctioned microchannels for MEMS microstructure releaseHamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. 
622006Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulationHamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. 
632008FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvementLeng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. 
642006Fabrication of platinum membrane on silicon for MEMS microphoneHamzah, A.A. ; Majlis, B.Y. ; Ahmad, I. 
652007Evaluation of different die attach film and epoxy pastes for stacked die QFN packageAhmad, I. ; Bachok, N.N. ; Chiang, N.C. ; Talib, M.Z.M. ; Rosle, M.F. ; Latip, F.L.A. ; Aziz, Z.A. 
662003Electrical testing for MEMS's piezoresistive pressure sensorAbd Wahab, M.Z.B. ; Sauli, Z.B. ; Ahmad, I. ; Suradi, W.B. 
672000Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devicesOmar, A. ; Ahmad, I. ; Alias, A.J. 
682011Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreaderLim, V. ; Amin, N. ; Foong, C.S. ; Ahmad, I. ; Zaharim, A. ; Rasid, R. ; Jalar, A. 
692006Effect of wafer thinning methods towards fracture strength and topography of silicon dieJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
702008Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)Kornain, Z. ; Amin, N. ; Jalar, A. ; Cheah, A.Y. ; Ahmad, I. 
712011Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substratesMuhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A. 
122006Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strengthEu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. 
132014Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi methodMaheran, A.H.A. ; Menon, P.S. ; Shaari, S. ; Kalaivani, T. ; Ahmad, I. ; Faizah, Z.A.N. ; Apte, P.R. 
142010Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packagesAmin, N. ; Cheah, A.Y. ; Ahmad, I. 
152006Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packagingEndut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. 
162006Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chippingJiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. 
172009Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvementLeng, E.P. ; Ling, W.T. ; Ding, M. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Haseeb, A.S.M.A. 
182008Dicing laminated wafer for QFN 3D stacked die packagingAbdullah, S. ; Endut, Z. ; Ahmad, I. ; Jalar, A. ; Yusof, S.M. 
192007Dicing die attach film for 3D stacked die QFN packagesAbdullah, S. ; Mohd Yusof, S. ; Ahmad, I. ; Jalar, A. ; Daud, R. 
202002Development of a simple in situ instrumentation for detection of breath alcohol and gas leakWagiran, R. ; Chong, A.G.E. ; Ahmad, I. ; Salleh, A.B.