Browsing by Author Fei, J.S.
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| Issue Date | Title | Author(s) |
|---|---|---|
| 2013 | Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Fei, J.S. ; Retnasamy, V. |