Browsing by Author Retnasamy, V.
Showing results 1 to 2 of 2
| Issue Date | Title | Author(s) |
|---|---|---|
| 2013 | Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Fei, J.S. ; Retnasamy, V. |
| 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |