Browsing by Author Yong, T.C.
Showing results 1 to 4 of 5
| Issue Date | Title | Author(s) |
|---|---|---|
| 2012 | Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability | Kar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C. |
| 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |
| 2014 | Manufacturability readiness of insulated Cu wire bonding process in PBGA package | Hungyang, L. ; Boonkar, Y. ; Yong, T.C. ; Khan, N. ; Ibrahim, M.R. ; Tan, L.C. |
| 2016 | The effects of zinc oxide on the sinterability of hydroxyapatite | Ching, T.Y. ; Singh, R. ; Yong, T.C. ; Kar, Y.B. |