Browsing by Author Hui, T.C.
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
|---|---|---|
| 2013 | Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests | Kar, Y.B. ; Hui, T.C. ; Agileswari, R. ; Lo, C. |
| 2013 | Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls | Kar, Y.B. ; Agileswari ; Hui, T.C. ; Talik, N.A. |
| 2012 | Solder ball robustness study on polymer core solder balls for BGA packages | Kar, Y.B. ; Hui, T.C. ; Agileswari ; Lo, C. |