Browsing by Author Lo, C.
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
|---|---|---|
| 2013 | Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests | Kar, Y.B. ; Hui, T.C. ; Agileswari, R. ; Lo, C. |
| 2015 | Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer | Shi, K.W. ; Yow, K.Y. ; Lo, C. ; Kar, Y.B. ; Misran, H. |
| 2012 | Solder ball robustness study on polymer core solder balls for BGA packages | Kar, Y.B. ; Hui, T.C. ; Agileswari ; Lo, C. |