| Issue Date | Title | Author(s) |
| 2010 | Charge transport of novel blue dibenzothiophene phenylenediamine copolymer | Kar, Y.B. ; Abdullah, S.F. ; Chou, Y.T. ; Kok, H.C. |
| 2013 | Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests | Kar, Y.B. ; Hui, T.C. ; Agileswari, R. ; Lo, C. |
| 2013 | Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls | Kar, Y.B. ; Agileswari ; Hui, T.C. ; Talik, N.A. |
| 2012 | Development of insulated Cu wire ball bonding | Leong, H.Y. ; Mohd, F.Z. ; Ibrahim, M.R. ; Kid, W.B. ; Khan, N. ; Kar, Y.B. ; Tan, L.C. |
| 2010 | Electrical stability of PLEDs | Kar, Y.B. ; Bradley, D. |
| 2013 | Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Fei, J.S. ; Retnasamy, V. |
| 2012 | Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability | Kar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C. |
| 2011 | Improvement of Cu-Al bond integrity on low k pad structures | Kid, W.B. ; Leng, E.P. ; Yong, C.C. ; Yi, O.X. ; Kar, Y.B. |
| 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |
| 2011 | Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire | Kid, W.B. ; Leng, E.P. ; Seong, L.B. ; Weily, C. ; Kar, Y.B. |
| 2015 | Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer | Shi, K.W. ; Yow, K.Y. ; Lo, C. ; Kar, Y.B. ; Misran, H. |
| 2012 | Solder ball robustness study on polymer core solder balls for BGA packages | Kar, Y.B. ; Hui, T.C. ; Agileswari ; Lo, C. |
| 2012 | Study on reliability test of die attach material | Yik, L.C. ; Kar, Y.B. ; Shafika, N. |
| 2016 | The effects of zinc oxide on the sinterability of hydroxyapatite | Ching, T.Y. ; Singh, R. ; Yong, T.C. ; Kar, Y.B. |
| 2017 | Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer | Shi, K.W. ; Kar, Y.B. ; Talik, N.A. ; Yew, L.W. |