Browsing by Author Jiun, H.H.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
|---|---|---|
| 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
| 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2006 | Effect of wafer thinning methods towards fracture strength and topography of silicon die | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |