Browsing by Author Kamarudin, H.
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| 2006 | Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength | Eu, P.-L. ; Ahmad, I. ; Jalar, A. ; Kamarudin, H. ; Majlis, B.Y. |