Browsing by Author Sukemi, N.M.
Showing results 1 to 3 of 3
| Issue Date | Title | Author(s) |
|---|---|---|
| 2006 | Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging | Endut, Z. ; Ahmad, I. ; Zaharim, A. ; Sukemi, N.M. |
| 2006 | Impact of low-k devices on failure mode of flip chip tensile pull test | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |
| 2006 | Solder bump strength and failure mode of low-k flip chip device | Endut, Z. ; Ahmad, I. ; Swee, G.L.H. ; Sukemi, N.M. |