Browsing by Author Seng, F.C.
Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) |
|---|---|---|
| 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
| 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
| 2012 | Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability | Kar, Y.B. ; Tahk, N.A. ; Seng, F.C. ; Yang, L.H. ; Vithyacharan, R. ; Yong, T.C. |
| 2013 | Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology | Kar, Y.B. ; Talik, N.A. ; Sauli, Z. ; Seng, F.C. ; Yong, T.C. ; Retnasamy, V. |