Browsing by Author Harif, M.N.
Showing results 1 to 2 of 11
| Issue Date | Title | Author(s) |
|---|---|---|
| 2010 | Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition | Harif, M.N. ; Ahmad, I. |
| 2006 | The effects of high temperature storage on lead free solder joint material strength using pull test method | Harif, M.N. ; Ahmad, I. ; Zaharim, A. |