Showing results 1 to 8 of 71
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| Issue Date | Title | Author(s) |
| 2008 | A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
| 2008 | A study of lead-free BGA backward compatibility through solderability testing at component level | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2008 | An efficient first order sigma delta modulator design | Amin, N. ; Guan, G.C. ; Ahmad, I. |
| 2009 | BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Han, T.Y. ; Chiao, C.W. ; Haseeb, A.S.M.A. |
| 2008 | Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package | Lim, V. ; Ahmad, I. ; Seng, F.C. ; Amin, N. ; Rasid, R. |
| 2018 | Compositional disparity in Cu2ZnSnS4 (CZTS) thin film deposited by RF-sputtering from a single quaternary compound target | Ferdaous, M.T. ; Chelvanathan, P. ; Shahahmadi, S.A. ; Sapeli, M.M.I. ; Sopian, K. ; Amin, N. |