Browsing by Author Bais, B.H.
Showing results 1 to 1 of 1
| Issue Date | Title | Author(s) |
|---|---|---|
| 2011 | Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates | Muhammad, N.A. ; Bais, B.H. ; Ahmad, I. ; Isnin, A. |