Showing results 1 to 19 of 142
next >
| Issue Date | Title | Author(s) |
| 2007 | A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish | Eu, P.-L. ; Ding, M. ; Hoh, H.-J. ; Rayos, J. ; Su, P. ; Lindsay, W. ; Chopin, S. ; Ahmad, I. |
| 2007 | A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish | Leng, E.P. ; Ding, M. ; Ahmad, I. ; Jalar, A. |
| 2008 | A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2009 | A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages | Amin, N. ; Lim, V. ; Seng, F.C. ; Razid, R. ; Ahmad, I. |
| 2004 | A simulation approach for dispatching techniques comparison in 200mm wafer foundry | Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. |
| 2010 | A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility | Chik, M.A. ; Yung, V.C. ; Balakrishna, P. ; Hashim, U. ; Ahmad, I. ; Mohamad, B. |
| 2008 | A study of lead-free BGA backward compatibility through solderability testing at component level | Leng, E.P. ; Ling, W.T. ; Amin, N. ; Ahmad, I. |
| 2007 | A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish | Leng, E.P. ; Ding, M. ; Rayos, J. ; Ahmad, I. ; Jalar, A. ; Qiang, C.C. |
| 2008 | A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint | Leng, E.P. ; Ding, M. ; Ling, W.T. ; Amin, N. ; Ahmad, I. ; Lee, M.Y. ; Haseeb, A.S.M.A. |
| 2006 | A study on inter-metallic compound formation and structure of lead free SnAgCu solder system | Ahmad, I. ; Jiun, H.H. ; Leng, E.P. ; Majlis, B.Y. ; Jalar, A. ; Wagiran, R. |
| 2006 | A study on lead free SnAgCu solder system | Hoh, H.J. ; Eu, P.L. ; Ding, M. ; Ahmad, I. |
| 2006 | Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance | Eu, P.L. ; Ding, M. ; Hoh, H.J. ; Ahmad, I. ; Hazlinda, K. |
| 2004 | Alternative double pass dicing method for thin wafer laminated with die attach film | Jiun, H.H. ; Ahmad, I. ; Jalar, A. ; Omar, G. |
| 2004 | An alternative approach to measures the application of dispatching rule in the wafer foundry | Chik, M.A. ; Ahmad, I. ; Jamaluddin, Md.Y. |
| 2004 | An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devices | Omar, A. ; Kamariah, S. ; Ahmad, I. |
| 2008 | An efficient first order sigma delta modulator design | Amin, N. ; Guan, G.C. ; Ahmad, I. |
| 2008 | An experimental study of defect determination using pulsed thermal non-destructive testing | Umar, M.Z. ; Ahmad, I. ; Hamzah, A.R. ; Abdullah, W.S.W. |
| 2010 | Analyze and optimize the silicide thickness in 45nm CMOS technology using Taguchi method | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. |
| 2011 | Analyze of input process parameter variation on threshold voltage in 45nm n-channel MOSFET | Salehuddin, F. ; Ahmad, I. ; Hamid, F.A. ; Zaharim, A. ; Elgomati, H.A. ; Majlis, B.Y. |